Emerging Strategies for High-Power-Density Thermal Management and Enhancement of Phase Change Heat Transport
MIE Department Seminar
October 22, 2019
11:00 AM - 12:00 PM
Emerging Strategies for High-Power-Density Thermal Management and Enhancement of Phase Change Heat Transport
Presenter: Justin A. Weibel, Research Associate Professor, Purdue University
Abstract:
The electronics industry is driven by global trends in storage, transmission, and processing of extreme quantities of data in the Zettabyte era, increasing electrification of the transportation sector, and the proliferation of interconnected computing devices. In view of these rapidly evolving markets, which brings new and extreme thermal management challenges, the Cooling Technologies Research Center (CTRC) at Purdue University addresses research and development needs of companies and organizations in the area of high-performance heat removal from compact spaces. This talk will review the ongoing research efforts related to the investigation of high-performance heat sinks, thermal interface materials, vapor chamber heat spreaders, and other novel active and passive cooling strategies. Specific technologies of interest for thermal management of high-power-density devices will rely on the phase change of a working fluid for dissipation of heat. Significant performance gains can be achieved through rational design of surface enhancements for phase change heat transport. Results from recent efforts will be covered during the seminar that include fabrication and characterization of intrachip microchannel heat sinks for dissipation of 1 kW/cm2 heat fluxes via evaporation of a dielectric coolant, and the manipulation of bubble departure and dryout hydrodynamics during high-heat-flux boiling processes.
Bio:
Justin A. Weibel is a Research Associate Professor in the School of Mechanical Engineering at Purdue University and Director of the Cooling Technologies Research Center (CTRC), a graduated NSF I/UCRC that addresses research and development needs of companies and organizations in the area of high-performance heat removal from compact spaces. He received his PhD in 2012 and BSME in 2007, both from Purdue University. His research group explores methodologies for prediction and control of heat transport to enhance the performance and efficiency of thermal management technologies and energy transfer processes. He has been a key contributor to the development of transformative high-heat-flux cooling technologies supported by the DARPA TGP (2008-2012), DARPA ICECool (2013-2017), NAVSEA NEEC (2016-2018), and ONR NETPUNE (2015-2020) programs, in addition to numerous sponsored research projects that transition these technologies to industry, with his funding totaling over $3.1M. Weibel will be the General Chair of IEEE’s ITherm Conference in 2021 and is Associate Editor of the IEEE Transactions on Components Packaging and Manufacturing Technology. Weibel’s academic record includes the supervision of 29 PhD and MS students and authorship of over 120 referred journal and conference papers (h-index of 24). He was recently recognized as an Outstanding Engineering Teacher by the College of Engineering at Purdue and as a student received the 2011 ASME Electronic & Photonic Packaging Division (EPPD) Member of the Year Award.
Host: Constantine Megaridis
Date posted
Sep 25, 2019
Date updated
Oct 15, 2019